Senior Packaging Engineer
SENIOR PACKAGING ENGINEER
LOCATION: Culver City, CA
RESPONSIBILITY: Packaging and integration of optical transmitters and receivers to meet high performance specifications and operate in harsh environmental conditions
JOB DESCRITPION: Team leader for packaging and integration of opto-electronic devices to meet Telcordia and Mil-Spec requirements. At least 5 years of experience as a lead packaging and product line engineer for, tunable lasers and 10 Gbps or higher speed optical transmitters and receivers required. Candidate will be responsible for packaging from design concept to package integration and testing.
Must be an expert in mechanical design and highly experienced SolidWorks user. SFP and equivalent package experience is highly desired. Extensive experience in fiber optic device package design, thermal engineering, hermetic packaging, fiber alignment, and environmental qualification is required. Manufacturing and quality control experience are highly desired. M.S. or Ph.D. in mechanical engineering or equivalent and at least 5 years of industry experience are required.
Must be strong in problem solving with excellent communication skills to interact with engineering staff, external vendors and contractors.
APIC Corp. is an industry leader in highly integrated Photonics and Electronics (HIP) technology, large-scale integration of Photonics with Electronics. The company is expanding manufacturing operations in Opto-Electronic packaging. Operations include government research,development, design, prototyping and production of specialized photonic products. Located in Culver City, CA. Competitive salaries and benefits.
Culver City, CA
Mon, 17 Apr 2017 15:21:15 PDT